Precio™ XL

Uf200 Prober Manuals
Tsk Uf200 Prober
Tsk Uf200 Prober Manual

Description of this manual is limited to the range of map data file specifications for Prober A-PM-90A. All data in the file is described in byte arrangements of Motorola (MSB-LSB). Therefore, it is necessary to notice that file data will be in Motorola’s byte arrangements and it is not. Tsk Uf3000 Prober Manual PDF: Tsk Uf3000 Prober Manual Doc: Tsk Uf3000 Prober Manual ePub: Tsk Uf3000 Prober Manual If looking for a book Tsk uf3000 prober manual in pdf form, then you have come on to the right site. We present the complete edition of this ebook in PDF, ePub, DjVu, txt, doc formats. You may reading online Tsk uf3000 prober. Accretech / TSK UF 200 Prober - Missing Parts. 425 30th Street Suite 26 Newport Beach, CA 92663 USA Office:+1949.396.1395. Uf200 prober manual tsk uf200 prober manual tsk uf200 prober manual vimeo and photobucket mislabeling some of the items in this app were' 'tsk prober manual riekko de april 20th, 2018 - tsk prober manual tsk prober manual title ebooks tsk prober manual category kindle and ebooks pdf author 9 / 41. 13565 SW Tualatin Sherwood Rd, Suite 500Sherwood, OR 97140 USA (503) 822-5182 sales@prober.com.

Precio™ XL is the latest 300mm fully automated wafer prober developed based on TEL Precio™ series. The Precio™ XL realizes high productivity, contact performance, cleanliness improvement, and short delivery time with a concept to further reduce test costs. TEL has also provided high-speed probe mark inspection TELPADS™-I and Auto Leveling (the probe card parallelism Automatic adjustment function), Users have available to them ZOOM-I which supports various Z-axis control for stable contact and soft contact, as option. The Precio™ XL wafer prober is compatible with the wafer parameters of previous Precio™ models. In addition, focusing not only on test operations but also on efficiency of setup file generation, we have introduced CoSMOz (Contact Sequence Map Optimization) software option. CoSMOz has the capability to calculate the optimum contact sequence, which was previously performed by customer test engineers. We have realized significant improvement in work efficiency and improvement in test efficiency.

The following tools are currently being used:

Facilities for Functional Test on Integrated Circuits

288 digital channels (256 providing up to 800Mb/s datarate, 32 providing up to 1.6Gb/s)
4.1GS arbitrary waveform generator
320MS/1GHz digitizer
1x 8 channel device power supply (max 4A/channel)
2x 4 channel device power supply (max 8A/channel)
Additional software for memory test and scan test analysis
Supports manual package test and automatic wafer test (using the UF200 wafer prober)

Uf200 Prober Manuals

Accretech UF200 wafer prober

Fully automatic wafer prober for up to 25 wafers/lot
Supports 6inch and 8inch wafers
Temperature controlled chuck, -40°C up to +125°C

256 digital channels (up to 125MHz)
4-channel Agilent power analyser
1 system configured for package test, the other system configured for wafer test

Accretech UF200A wafer prober

Standard chuck (not temperature controlled)

Spectral range 7.5 .. 14µm
Temperature measurement range -40°C .. 1200°C
Image size 640x480

Standard lens 1.0/30 mm

image area (30 x 23)°,

minimum distance 300mm

Microscope objective 1,0x

Tsk Uf200 Prober

image (16 x 12) mm²,

Tsk Uf200 Prober Manual

distance 50 mm, resolution 25µm
Online: up to 10 points
Offline: temperature of each pixel can be determined, additionally regions with min/max evaluation can be defined
Usage: e.g. detection of hot spots on chips (caused by shorts), thermal check of PCBs, etc